Overseas Chinese Innovation Competition to Add France, Hong

May 15, 2025, Chengdu – The Overseas Chinese Innovation and Entrepreneurship Competition is set to establish new sub-venues in Paris, France and Hong Kong, China. This initiative receives key support from the Chengdu Municipal Civil Affairs Bureau’s 2024 Special Fund for Social Organization Development, aiming to broaden global high-level talent recruitment channels and strengthen the local industrial chain ecosystem.

Relevant officials emphasized that the new sub-venues will align with Chengdu’s core industrial development needs in electronics, biomedicine, and artificial intelligence. The competition now invites global talents to participate, requiring projects to demonstrate technological innovation, industrialization potential, and relevance to Chengdu’s key industrial chains.

"By expanding sub-venues, we aim to attract more high-quality projects matching Chengdu’s industrial direction," stated a Civil Affairs Bureau representative. From June to July 2025, applicants may submit proposals in fields like smart manufacturing and green low-carbon via official channels.